Physical Vapor Deposition (PVD)
PVD systems are used to coat surfaces with a desired material such as Au, Ti, SiO2 etc via e-beam , RF or DC sputtering. The film thickness can range from few nanometers up to several micrometers.
Sputter coaters are typically used to rapidly sputter coat a non-conducting surface with a metal film for SEM imaging.
Not sure what is best for you?
Send us your questions and our team of scientific and technical experts will contact you to find out what is best for your task and we will work on a solution.