Mask Aligner - Karl Süss MA 150 ML
Mask aligners are UV exposure systems used to expose a photosensitive thin film that is spin coated on a wafer. A chrome mask carrying the pattern is used to block or allow the UV light is specific areas. The MA 150 ML is equipped with a 350 W Hg lamp, front and back side alignment capabilities in proximity and contact printing and can handle samples from small pieces to 100 mm wafers.
Spin Coater - RRT Lanz EBS 11
Spin coaters are used for depositing materials onto substrates with accurate and controllable film thickness. During rotation of the sample, the fluid spins off the edges of the substrate until desired thickness of the film is achieved. Available resists in house: AZ 5214 E, AZ 1514H, PMMA (A2, A4, A7).
Adhesion promoter - Yield YES LP III
HMDS ovens are used for substrate dehydration and vapor deposition of hexamethyldisilizane (HMDS). It is a lithography preprocess needed to promote the chemical adhesion of a photoresist to a substrate.
Dry Etching (ICP-RIE) - Alcatel AMS110 SE
Dry etching in nano and micro fabrication refers to the removal of material by exposure of the material to a plasma of reactive gases such as sulfur hexafluoride, chlorine, oxygen etc. Plasma is generated by applying 13.56 MHz RF electromagnetic field and introducing gases under vacuum in the chamber. The charged ions attack the surface with high velocity removing material from the sample leading to an anisotropic etching of unmasked areas.
Wet benches are used for wet etching and cleaning of wafers and devices as well as development processes. We distinguish between acid wet benches, a solvent bench and spin dryers for drying. Possibilities are: Anisotropic Si etching, SiO2 etching, SiN etching, RCA-1 and RCA-2 cleaning, 7-UP bath, KOH bath, lift-off bath, resist strip bath and developer bath.
Plasma Asher - LFE 120 Barrel Plasma System
Plasma ashers use regulated oxygen flow to generate oxygen plasma to remove organic compounds, such as photoresist, off a surface. In addition polymer activation can be done to seal channels on a PDMS LOC or to bond PDMS pieces together.
Hot plates are used in photolithography processes in order to solidify the spin-coated resist, but they can be also used for annealing samples.
Fume hoods allow processing of devices, materials and chemicals without particles affecting the cleanroom environment.
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